1. UniMAP Library Digital Repository
  2. Researchers

Vithyacharan Retnasamy : [54] Collection home page

Logo
This page provides access to research works by Vithyacharan Retnasamy, currently a Senior Lecturer of School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP).

Browse
Subscribe to this collection to receive daily e-mail notification of new additions RSS Feed RSS Feed RSS Feed
Collection's Items (Sorted by Submit Date in Descending order): 1 to 20 of 54
 next >
Issue DateTitleAuthor(s)
Feb-2014LED heat dissipation analysis using composite based cylindrical slugZaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan; zaliman@unimap.edu.my
Feb-2014Effects of heat slug shapes on the heat dissipation of high power LEDZaliman, Sauli, Dr.; Vairavan, Rajendaran;; Retnasamy, Vithyacharan; zaliman@unimap.edu.my
Apr-2014Wettability and surface roughness study on RIE treated aluminium deposited surfaceRetnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Uda, Hashim, Prof. Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; Ramzan, Mat Ayub; vc.sundres@gmail.com
Oct-2013Heat dissipation analysis under natural convection condition on high power LEDVairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
Oct-2013High power LED heat dissipation analysis via copper diamond slugVairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
Oct-2013LED heat dissipation study using different Cu slug sizeVairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; vc.sundres@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013Numerical analysis of velocity profile in a FFS microchannelNor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013FSS microchannel fluid flow profile investigation at high and low Re numberNor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013Low density fibrous material surface light reflectance analysisOng, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013Shear strain analysis in FSS microchannelZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nor Shakirina, Nadzri; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013Cylindrical shape slug heat conduction numerical analysis using copper materialZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
2013Bump height at low temperature analysisZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass; zaliman@unimap.edu.my; rcharan@unimap.edu.my; fairul@unimap.edu.my; phaklen@unimap.edu.my; steven@unimap.edu.my
2013Shear speed analysis on Sn-3.9Ag-0.6Cu SolderZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my
20135mm × 5mm sized slug on high power LED stress and junction temperature analysisZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; nazuhusna@unimap.edu.my
2013Aluminium surface grain size analysis on RIE treatmentZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my
2013Relationship between controllable process parameters on bump height in ENIGZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; muhamadhafiz@unimap.edu.my
Oct-2013Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseousRetnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Aaron, Koay Terr Yeow; Goh, Siew Chui; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
2013Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyYap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan; kbyap@uniten.edu.my; zaliman@unimap.edu.my; sundres@gmail.com
2013Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUSYap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; kbyap@uniten.edu.my; zaliman@unimap.edu.my; vc.sundres@gmail.com
Collection's Items (Sorted by Submit Date in Descending order): 1 to 20 of 54
 next >
Skills and Expertise:Thin Films and Nanotechnology,Stress Analysis,Nanoelectronics Electronic Engineering,Semiconductor,Microelectronics and Semiconductor Engineering Microelectronics,Industrial Engineering,Manufacturing Engineering,GaN,ANSYS Copper,Polymers & Microfluidics,LED,Grid,Light Emitting Diode,Soldering Microelectromechanical Systems (MEMS),Scopus,Machine Parameter Optimization Design of Experiments-Full facorial,Microfabrication Process Optimization and Semiconductor Packaging Process Optimization.

Discover