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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35374| Title: | 5mm × 5mm sized slug on high power LED stress and junction temperature analysis |
| Authors: | Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Vairavan, Rajendaran Nazuhusna, Khalid zaliman@unimap.edu.my vc.sundress@gmail.com fairul@unimap.edu.my phaklen@unimap.edu.my nazuhusna@unimap.edu.my |
| Keywords: | 5mm × 5mm heat slug Aluminum heat slug Ansys Single chip LED Thermal analysis |
| Issue Date: | 2013 |
| Publisher: | Trans Tech Publications (TTP) |
| Citation: | Applied Mechanics and Materials, vol. 404, 2013, pages 460-464 |
| Abstract: | Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and efficiency of the LED is dependent on the junction temperature. This study presents the thermal simulation of single chip LED package with 5mm ×5mm× 1mm aluminum heat slug. The junction temperature and stress of LED chip were evaluated using Ansys version 11. Input power of 0.1 W and 1 W were applied to the LED. The simulation results showed that at input power of 1W, the maximum junction temperature and stress of the LED chip is 112.91°C and 263.82Mpa respectively. |
| Description: | Link to publisher's homepage at http://www.ttp.net/ |
| URI: | http://www.scientific.net/AMM.404.460 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35374 |
| ISBN: | 978-303785845-5 |
| ISSN: | 1660-9336 |
| Appears in Collections: | Vithyacharan Retnasamy Zaliman Sauli, Lt. Kol. Professor Dr. Fairul Afzal Ahmad Fuad School of Microelectronic Engineering (Articles) School of Computer and Communication Engineering (Articles) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 5mm × 5mm sized slug on high power LED stress and junction temperature analysis.pdf | 6.7 kB | Adobe PDF | View/Open |
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