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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35374
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dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorFairul Afzal, Ahmad Fuad-
dc.contributor.authorEhkan, Phaklen, Dr.-
dc.contributor.authorVairavan, Rajendaran-
dc.contributor.authorNazuhusna, Khalid-
dc.date.accessioned2014-06-11T08:28:40Z-
dc.date.available2014-06-11T08:28:40Z-
dc.date.issued2013-
dc.identifier.citationApplied Mechanics and Materials, vol. 404, 2013, pages 460-464en_US
dc.identifier.isbn978-303785845-5-
dc.identifier.issn1660-9336-
dc.identifier.urihttp://www.scientific.net/AMM.404.460-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35374-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractConventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and efficiency of the LED is dependent on the junction temperature. This study presents the thermal simulation of single chip LED package with 5mm ×5mm× 1mm aluminum heat slug. The junction temperature and stress of LED chip were evaluated using Ansys version 11. Input power of 0.1 W and 1 W were applied to the LED. The simulation results showed that at input power of 1W, the maximum junction temperature and stress of the LED chip is 112.91°C and 263.82Mpa respectively.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications (TTP)en_US
dc.subject5mm × 5mm heat slugen_US
dc.subjectAluminum heat slugen_US
dc.subjectAnsysen_US
dc.subjectSingle chip LEDen_US
dc.subjectThermal analysisen_US
dc.title5mm × 5mm sized slug on high power LED stress and junction temperature analysisen_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundress@gmail.comen_US
dc.contributor.urlfairul@unimap.edu.myen_US
dc.contributor.urlphaklen@unimap.edu.myen_US
dc.contributor.urlnazuhusna@unimap.edu.myen_US
Appears in Collections:Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
Fairul Afzal Ahmad Fuad
School of Microelectronic Engineering (Articles)
School of Computer and Communication Engineering (Articles)

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