Aluminium surface grain size analysis on RIE treatment

Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35370

Title:	Aluminium surface grain size analysis on RIE treatment
Authors:	Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Palianysamy, Moganraj Aaron, Koay Terr Yeow zaliman@unimap.edu.my vc.sundress@gmail.com fairul@unimap.edu.my phaklen@unimap.edu.my
Keywords:	Aluminium Grain size Reactive ion etching
Issue Date:	2013
Publisher:	Trans Tech Publications (TTP)
Citation:	Applied Mechanics and Materials, vol. 404, 2013, pages 67-71
Abstract:	Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. RIE parameters are varied to obtain 16 different recipes which are done using Design of Experiment. Grain size of the samples is recorded for all 16 samples before and after RIE treatment. This produces results that can be compared to obtain the effect of RIE on the aluminum film. Results show that RIE affects the mean grain size of the aluminum film as it increases after RIE treatment.
Description:	Link to publisher's homepage at http://www.ttp.net/
URI:	http://www.scientific.net/AMM.404.67 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35370
ISBN:	978-303785845-5
ISSN:	1660-9336
Appears in Collections:	Vithyacharan Retnasamy Zaliman Sauli, Lt. Kol. Professor Dr. Fairul Afzal Ahmad Fuad School of Microelectronic Engineering (Articles) School of Computer and Communication Engineering (Articles)

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