1. UniMAP Library Digital Repository
  2. Journal Articles
  3. School of Microelectronic Engineering (Articles)
Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35370
Full metadata record
DC FieldValueLanguage
dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorFairul Afzal, Ahmad Fuad-
dc.contributor.authorEhkan, Phaklen, Dr.-
dc.contributor.authorPalianysamy, Moganraj-
dc.contributor.authorAaron, Koay Terr Yeow-
dc.date.accessioned2014-06-11T07:45:23Z-
dc.date.available2014-06-11T07:45:23Z-
dc.date.issued2013-
dc.identifier.citationApplied Mechanics and Materials, vol. 404, 2013, pages 67-71en_US
dc.identifier.isbn978-303785845-5-
dc.identifier.issn1660-9336-
dc.identifier.urihttp://www.scientific.net/AMM.404.67-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35370-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractReactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. RIE parameters are varied to obtain 16 different recipes which are done using Design of Experiment. Grain size of the samples is recorded for all 16 samples before and after RIE treatment. This produces results that can be compared to obtain the effect of RIE on the aluminum film. Results show that RIE affects the mean grain size of the aluminum film as it increases after RIE treatment.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications (TTP)en_US
dc.subjectAluminiumen_US
dc.subjectGrain sizeen_US
dc.subjectReactive ion etchingen_US
dc.titleAluminium surface grain size analysis on RIE treatmenten_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundress@gmail.comen_US
dc.contributor.urlfairul@unimap.edu.myen_US
dc.contributor.urlphaklen@unimap.edu.myen_US
Appears in Collections:Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
Fairul Afzal Ahmad Fuad
School of Microelectronic Engineering (Articles)
School of Computer and Communication Engineering (Articles)

Files in This Item:
File Description SizeFormat 
Aluminium surface grain size analysis on RIE treatment.pdf5.94 kBAdobe PDFView/Open
Show simple item record


Items in UniMAP Library Digital Repository are protected by copyright, with all rights reserved, unless otherwise indicated.