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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128
Title: LED heat dissipation analysis using composite based cylindrical slug
Authors: Zaliman, Sauli, Dr.
Vairavan, Rajendaran
Retnasamy, Vithyacharan
zaliman@unimap.edu.my
Keywords: ANSYS
Cu/Dia cylindrical heat slug
Junction temperature
LED
Von mises stress
Issue Date: Feb-2014
Publisher: Trans Tech Publications Inc.
Citation: Advanced Materials Research, vol.893, 2014, pages 803-806
Abstract: The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.
Description: Link to publisher's homepage at http://www.ttp.net/
URI: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128
ISSN: 1662-8985
Appears in Collections:Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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