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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128
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dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorVairavan, Rajendaran-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.date.accessioned2015-03-06T09:11:17Z-
dc.date.available2015-03-06T09:11:17Z-
dc.date.issued2014-02-
dc.identifier.citationAdvanced Materials Research, vol.893, 2014, pages 803-806en_US
dc.identifier.issn1662-8985-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/39128-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThe optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports a simulation analysis on the heat dissipation of single chip LED package with based material, copper diamond (Cu/Dia) cylindrical heat slug.Ansys version 11 was utilized as the simulation platform. The junction temperature and stress of the LED chip under natural convection condition were evaluated with varied input power of 0.1 W, 0.5 W and 1 W. Results indicated the maximum junction temperature of LED chip was attained at input power of 1 W.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications Inc.en_US
dc.subjectANSYSen_US
dc.subjectCu/Dia cylindrical heat slugen_US
dc.subjectJunction temperatureen_US
dc.subjectLEDen_US
dc.subjectVon mises stressen_US
dc.titleLED heat dissipation analysis using composite based cylindrical slugen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMR.893.803-
dc.contributor.urlzaliman@unimap.edu.myen_US
Appears in Collections:Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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