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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35388| Title: | Bump height at low temperature analysis |
| Authors: | Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Steven, Taniselass zaliman@unimap.edu.my rcharan@unimap.edu.my fairul@unimap.edu.my phaklen@unimap.edu.my steven@unimap.edu.my |
| Keywords: | Bump height Controllable parameters DOE ENIG |
| Issue Date: | 2013 |
| Publisher: | Trans Tech Publications (TTP) |
| Citation: | Applied Mechanics and Materials, vol. 404, 2013, pages 77-81 |
| Abstract: | The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70°C. Electroless nickel time has more influence to the bump height compared to immersion gold time. |
| Description: | Link to publisher's homepage at http://www.ttp.net/ |
| URI: | http://www.scientific.net/AMM.404.77 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35388 |
| ISBN: | 978-303785845-5 |
| ISSN: | 1660-9336 |
| Appears in Collections: | Steven Taniselass, Mr. Vithyacharan Retnasamy Zaliman Sauli, Lt. Kol. Professor Dr. Fairul Afzal Ahmad Fuad School of Microelectronic Engineering (Articles) School of Computer and Communication Engineering (Articles) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Bump height at low temperature analysis.pdf | 6.05 kB | Adobe PDF | View/Open |
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