UniMAP Library Digital Repository JSPUI

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Issue Date	Title	Author(s)
Feb-2014	LED heat dissipation analysis using composite based cylindrical slug	Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan; zaliman@unimap.edu.my
Feb-2014	Effects of heat slug shapes on the heat dissipation of high power LED	Zaliman, Sauli, Dr.; Vairavan, Rajendaran;; Retnasamy, Vithyacharan; zaliman@unimap.edu.my
Apr-2014	Wettability and surface roughness study on RIE treated aluminium deposited surface	Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Uda, Hashim, Prof. Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; Ramzan, Mat Ayub; vc.sundres@gmail.com
Oct-2013	Heat dissipation analysis under natural convection condition on high power LED	Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
Oct-2013	High power LED heat dissipation analysis via copper diamond slug	Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
Oct-2013	LED heat dissipation study using different Cu slug size	Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; vc.sundres@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013	Numerical analysis of velocity profile in a FFS microchannel	Nor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013	FSS microchannel fluid flow profile investigation at high and low Re number	Nor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013	Low density fibrous material surface light reflectance analysis	Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013	Shear strain analysis in FSS microchannel	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nor Shakirina, Nadzri; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013	Cylindrical shape slug heat conduction numerical analysis using copper material	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
2013	Bump height at low temperature analysis	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass; zaliman@unimap.edu.my; rcharan@unimap.edu.my; fairul@unimap.edu.my; phaklen@unimap.edu.my; steven@unimap.edu.my
2013	Shear speed analysis on Sn-3.9Ag-0.6Cu Solder	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my
2013	5mm × 5mm sized slug on high power LED stress and junction temperature analysis	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; nazuhusna@unimap.edu.my
2013	Aluminium surface grain size analysis on RIE treatment	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my
2013	Relationship between controllable process parameters on bump height in ENIG	Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; muhamadhafiz@unimap.edu.my
Oct-2013	Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous	Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Aaron, Koay Terr Yeow; Goh, Siew Chui; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013	Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3	Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
2013	Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology	Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan; kbyap@uniten.edu.my; zaliman@unimap.edu.my; sundres@gmail.com
2013	Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS	Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; kbyap@uniten.edu.my; zaliman@unimap.edu.my; vc.sundres@gmail.com

Skills and Expertise:Thin Films and Nanotechnology,Stress Analysis,Nanoelectronics Electronic Engineering,Semiconductor,Microelectronics and Semiconductor Engineering Microelectronics,Industrial Engineering,Manufacturing Engineering,GaN,ANSYS Copper,Polymers & Microfluidics,LED,Grid,Light Emitting Diode,Soldering Microelectromechanical Systems (MEMS),Scopus,Machine Parameter Optimization Design of Experiments-Full facorial,Microfabrication Process Optimization and Semiconductor Packaging Process Optimization.