Now showing items 1-20 of 181

    • A 1.5 V, 0.85-13.35 GHZ MMIC low noise amplifier design using optimization technique 

      Arjuna, Marzuki; Ali Yeon, Md. Shakaff, Prof. Dr.; Zaliman, Sauli, Prof. Madya (Institution of Electronics and Telecommunication Engineers (IETE), 2009-11-01)
      This paper describes how a broadband, 1.5 V, 0.85-13.35 GHz low noise amplifier in 0.15 μm 85 GHz PHEMT process is synthesized to simultaneously meet multiple design specifications such as bandwidth, noise figure, power ...
    • A 2.4 GHz 0.18-μm CMOS class E single-ended power amplifier without spiral inductors 

      Sohiful Anuar, Zainol Murad; Pokharel, R. K.; Kanaya, H.; Yoshida, K. (IEEE, 2010-01-11)
      This paper describes the design of a 2.4-GHz CMOS Class E single-ended power amplifier (PA) for wireless applications in TSMC 0.18-μm CMOS technology. The Class E PA proposed in this paper realizes all inductors with ...
    • 3D shape measurement and reconstruction using fringe projection 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nor Shakirina, Nadzri; Veriven, Christopher John (Trans Tech Publications, 2014)
      Digital fringe projection technique using phase shifting method has been studied extensively for generatingthree dimensional (3D) surface information. The aim of this paper is to develop a simple automated optical inspection ...
    • 5-11 GHz CMOS PA with 158.9 ± 41 ps group delay and low power using current-reused technique 

      Rohana, Sapawi, Dr.; Sohiful Anuar, Zainol Murad, Dr.; Dayang Azra, Awang Mat (Elsevier GmbH, 2012-11)
      This paper proposes the design of a low group delay and low power ultra-wideband (UWB) power amplifier (PA) in 0.18 μm CMOS technology. The PA design employs two stages cascade with inductive peaking technique to provide ...
    • 5mm × 5mm sized slug on high power LED stress and junction temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid (Trans Tech Publications (TTP), 2013)
      Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...
    • Ab-initio calculations of Co-based diluted magnetic semiconductors Cd1-x Cox X (X=S, Se, Te) 

      Saeed, Y.; Nazir, S.; Shaukat, A.; Reshak, Ali H. (Elsevier B. V., 2010-10)
      Ab-initio calculations are performed to investigate the structural, electronic and magnetic properties of spin-polarized diluted magnetic semiconductors composed of II-VI compounds Cd1-x Cox X (X=S, Se, Te) at x=0.25. ...
    • Alignment mark architecture effect on alignment signal behavior in advanced lithography 

      Normah, Ahmad; Uda, Hashim; Mohd Jeffrey, Manaf; Kader Ibrahim, Abdul Wahab (Institute of Electrical and Electronics Engineering (IEEE), 2006)
      The downscaling of CMOS technology becomes a challenge to the scanner alignment system since overlay and alignment accuracy becomes tighter. Such a tight overlay requirement requires a very stable alignment performance. A ...
    • Aluminium surface grain size analysis on RIE treatment 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow (Trans Tech Publications (TTP), 2013)
      Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...
    • Analysis on surface roughness and surface reflectance through DOE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ong, Tee Say (Trans Tech Publications, 2014)
      The Lambda 950 spectrometers are designed to investigate and examine surface coating on test specimen by using the light source. The objective of this research is to investigate the factors that affect the surface roughness ...
    • BaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approach 

      Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      Barium Strontium Titanate (BST) a common topic in the microelectronic field for many devices which is mainly on dynamic random access memories (DRAM). There are many methods of preparing BaₓSr₁-ₓTiO3; barium strontium ...
    • Bioreactor profile control by a nonlinear auto regressive moving average neuro and two degree of freedom PID controllers 

      Ubaid, Imtiaz; Jamuar, Sudhanshu Shekhar, Prof. Dr.; Sahu, Jaya Narayan; Ganesan, Poo Balan (Elsevier Ltd., 2014-11)
      This paper presents the use of nonlinear auto regressive moving average (NARMA) neuro controller for temperature control and two degree of freedom PID (2DOF-PID) for pH and dissolved oxygen (DO) of a biochemical reactor ...
    • Bismuth zinc niobate pyrochlore, a relaxor-like non-ferroelectric 

      Rozana Aina, Maulat Osman, Dr.; Masó, Nahum; West, Anthony R. (The American Ceramic Society, 2012-01)
      Fixed frequency plots of ε and tan δ versus temperature for (Bi 1.5Zn 0.5)(Zn 0.5Nb 1.5)O 7 (BZN) ceramics with the pyrochlore structure show relaxor-like response below ∼180 K with frequency-independent permittivity of ...
    • Bismuth zinc niobate pyrochlore, a relaxor-like non-ferroelectric 

      Rozana Aina, Maulat Osman, Dr.; Maso, Nahum; West, Anthony R. (The American Ceramic Society, 2012-01)
      Fixed frequency plots of ε and tan δ versus temperature for (Bi 1.5Zn 0.5)(Zn 0.5Nb 1.5)O 7 (BZN) ceramics with the pyrochlore structure show relaxor-like response below ∼180 K with frequency-independent permittivity of ...
    • Borophosphosilicate glass (BPSG) reflow characterization for submicron CMOS technology 

      Uda, Hashim; Ramzan, Mat Ayub; Nik Hazura, Nik Hamat (Universiti Kebangsaan Malaysia, 2007)
      This paper involves the planarization of borophosphosilicate glass (BPSG) film using a new recipe for annealing process to improve the borophosphosilicate glass (BPSG) film flatness after reflow. This improvement is for ...
    • A brief review of layered rock salt cathode materials for lithium ion batteries 

      Tan, Tze Qing; Soo, Soon Peng; Azmi, Rahmat, Prof.; Shamsul Baharin,  Jamaludin, Prof. Dr.; Rozana Aina, Maulat Osman, Dr. ; Zul Azhar, Zahid Jamal, Dato Prof. Dr.; Mohd Sobri, Idris, Dr. (Trans Tech Publications, 2013)
      Nowadays, many researchers have been studying on the layered rock salt-type structure as cathode materials for the lithium ion batteries. LiCoO2 is the most commonly used cathode material but Co is costly and toxic. Thus, ...
    • Bump height at low temperature analysis 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
      The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
    • Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor 

      Mohd Khairuddin, Md Arshad; Uda, Hashim; Choo, C.M. (Institute of Electrical and Electronics Engineering (IEEE), 2006)
      In this paper we report the characterizations results of Serial Peripheral Interface (SPI) timing parameters for optical mouse sensor. SPI is an interface that facilitates the transfer of synchronous serial data. It supports ...
    • The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition 

      Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar (Science Publications, 2007)
      This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ...
    • Characterization of intermetallic growth of gold ball bonds on aluminum bond pads 

      Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Mohammad Nuzaihan Md. Noor; Uda, Hashim (University of Malaya, 2008)
      In this paper the intermetallic growth between gold ball bond and aluminum bond pad are studied. It involves thermal aging at 150 °C and 200 °C for various time intervals. The relationship between electrical resistance and ...
    • Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process 

      Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad (Elsevier Science, 2007)