Issue Date | Title | Author(s) |
2013 | 5mm × 5mm sized slug on high power LED stress and junction temperature analysis | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; nazuhusna@unimap.edu.my |
2013 | Aluminium surface grain size analysis on RIE treatment | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my |
Jan-2014 | CuDia slug size variation analysis on heat dissipation of high power LED | Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; vc.sundress@gmail.com |
Oct-2013 | Cylindrical shape slug heat conduction numerical analysis using copper material | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my |
Oct-2013 | FSS microchannel fluid flow profile investigation at high and low Re number | Nor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my |
Oct-2013 | Low density fibrous material surface light reflectance analysis | Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my |
Oct-2013 | Numerical analysis of velocity profile in a FFS microchannel | Nor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my |
2013 | Relationship between controllable process parameters on bump height in ENIG | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz, Ab Aziz; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; muhamadhafiz@unimap.edu.my |
2013 | Shear speed analysis on Sn-3.9Ag-0.6Cu Solder | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my |
Oct-2013 | Shear strain analysis in FSS microchannel | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nor Shakirina, Nadzri; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my |
Oct-2013 | Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous | Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Aaron, Koay Terr Yeow; Goh, Siew Chui; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my |
Dec-2012 | Wire bond shear test simulation on hemispherical surface bond pad | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj; W.M.W. Norhaimi, J. Adnan, M. Palianysamy; vc.sundress@gmail.com |
Dec-2012 | Wire bond shear test simulation on sharp groove surface bond pad | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran; vc.sundress@gmail.com |