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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/32661
Title: Wire bond shear test simulation on sharp groove surface bond pad
Authors: Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Ahmad Husni, Mohd Shapri
Vairavan, Rajendaran
vc.sundress@gmail.com
Keywords: ANSYS
Sharp groove surface
Shear test
Wire bond
Issue Date: Dec-2012
Publisher: Trans Tech Publications
Citation: Advanced Materials Research, vol.262-623, 2012, pages 647-651
Abstract: Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.
Description: Link to publisher's homepage at http://www.ttp.net/
URI: http://dspace.unimap.edu.my:80/dspace/handle/123456789/32661
ISSN: 1662-8985
Appears in Collections:Steven Taniselass, Mr.
Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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