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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/32661
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dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorTaniselass, Steven-
dc.contributor.authorAhmad Husni, Mohd Shapri-
dc.contributor.authorVairavan, Rajendaran-
dc.date.accessioned2014-03-13T04:12:15Z-
dc.date.available2014-03-13T04:12:15Z-
dc.date.issued2012-12-
dc.identifier.citationAdvanced Materials Research, vol.262-623, 2012, pages 647-651en_US
dc.identifier.issn1662-8985-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/32661-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractWire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectANSYSen_US
dc.subjectSharp groove surfaceen_US
dc.subjectShear testen_US
dc.subjectWire bonden_US
dc.titleWire bond shear test simulation on sharp groove surface bond paden_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMR.622-623.647-
dc.contributor.urlvc.sundress@gmail.comen_US
Appears in Collections:Steven Taniselass, Mr.
Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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