School of Microelectronic Engineering (Articles): Recent submissions

Now showing items 41-60 of 185

    • Ferroelectric and relaxor ferroelectric to paralectric transition based on Lead Magnesium Niobate (PMN) materials 

      Rozana Aina, Maulat Osman, Dr.; Mohd Sobri, Idris, Dr.; Zul Azhar, Zahid Jamal, Dato Prof. Dr.; Sanna, Taking, Dr.; Syarifah Norfaezah, Sabki, Dr.; Poopalan, Prabakaran, Dr.; Mohd Natashah, Norizan; Ili Salwani, Mohamad (Trans Tech Publications, 2013)
      First ferroelectric materials were found in Rochelle salt was in a perovskite structure. Lead Magnesium Niobate (PMN) is a perovskites with a formula of PbMg1/3Nb2/3O3 (PMN) and are typical representatives for most of all ...

    • Electrical properties of fresnoite Ba2TiSi2O8 using impedance spectroscopy 

      Rozana Aina, Maulat Osman, Dr. ; Mohd Sobri, Idris, Dr. (Trans Tech Publications, 2013)
      Fresnoite with composition Ba2TiSi2O8 (B2TS2) was first found in 1965, adopting a non-centrosymmetric structure. It also reported to crystallize in a tetragonal unit cell with a=8.52Å and c=5.210Å leading to some possible ...

    • Design and analysis of wideband ladder-type film bulk acoustic wave resonator filters in Ku-band 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Hindawi Publishing Corporation, 2013)
      This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of -3 dB, out-of-band rejection of -12 dB and 3 dB bandwidth ...

    • Design and simulation of film bulk acoustic wave resonator in kuband 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications, 2013)
      This paper presents the design of a Film Bulk Acoustic Wave Resonators (FBARs) operating in Ku-band. The one-dimensional (1-D) numerical and the three-dimension (3-D) Finite Element Method (FEM) simulation results are ...

    • Development of varied CMOS ring oscillator topologies in 0.13-μm CMOS technology 

      Sohiful Anuar, Zainol Murad, Dr.; Rizalafande, Che Ismail, Dr.; Mukhzeer, Mohamad Shahimin, Dr.; Mohd Fairus, Ahmad; Rohana, Sapawi (Trans Tech Publications Inc., 2014)
      This paper presents varied CMOS ring oscillator topologies using Silterra 0.13-µm Process. Three topologies of ring oscillators have been designed which is the single-ended ring oscillator, differential ring oscillator and ...

    • Film bulk acoustic wave resonator filter for Ku-band applications 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications (TTP), 2013)
      The design and analysis of Ku-band ladder-type filters based on film bulk acoustic wave resonator (FBAR) is presented. The proposed FBAR filter has an insertion loss of -3dB, out-of-band rejection of -12dB, centre frequency ...

    • UTBB SOI MOSFETs analog figures of merit: Effects of ground plane and asymmetric double-gate regime 

      Mohd Khairuddin, Md. Arshad; Makovejev, Sergej; Olsen, Sarah H.; Andrieu, F.; Raskin, Jean Pierre; Flandre, Denis; Kilchytska, Valeriya I. (Elsevier Ltd., 2013)
      In this work we investigate the effect of ground plane (GP) on analog figures of merit (FoM) of ultra-thin body and thin buried oxide (UTBB) SOI MOSFETs. Based on experimental devices, both n- and p-type GP configurations ...

    • Terahertz detection using nanorectifiers 

      Shahrir Rizal, Kasjoo, Dr.; Aimin, Song, Prof. (Institute of Electrical and Electronics Engineers (IEEE), 2013-12)
      We report on the low-temperature detection of free-space radiation at 1.5 THz using a unipolar nanodiode, known as the self-switching diode (SSD), coupled with a spiral microantenna. The SSD, based on an asymmetric ...

    • Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ...

    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...

    • Surface roughness and wettability correlation on etched platinum using reactive ion ecthing 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Goh, Siew Chui; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ...

    • Natural heat convection analysis on cylindrical Al slug of LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah; Nazuhusna, Khalid (Trans Tech Publications, 2014-01)
      This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...

    • Main effects study on plasma etched aluminium metallization 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014-01)
      Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ...

    • BaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approach 

      Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      Barium Strontium Titanate (BST) a common topic in the microelectronic field for many devices which is mainly on dynamic random access memories (DRAM). There are many methods of preparing BaₓSr₁-ₓTiO3; barium strontium ...

    • Operating temperature analysis of LED with cylindrical Cu slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ...

    • CuDia slug size variation analysis on heat dissipation of high power LED 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr. (Trans Tech Publications, 2014-01)
      The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...

    • Heat sink fin number variation analysis on single chip high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...

    • WSS investigation in microfluidic FFS channel at Re 500 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Nor Shakirina, Nadzri; Hsio Mei, Tan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014-01)
      Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...

    • Fibrous material density difference analysis using light reflectance 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ...

    • Analysis on surface roughness and surface reflectance through DOE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ong, Tee Say (Trans Tech Publications, 2014)
      The Lambda 950 spectrometers are designed to investigate and examine surface coating on test specimen by using the light source. The objective of this research is to investigate the factors that affect the surface roughness ...