School of Microelectronic Engineering (Articles): Recent submissions

Now showing items 161-180 of 185

    • Characterization of robust alignment mark to improve alignment performance 

      Normah, Ahmad; Uda, Hashim; Mohd Jefrey, Manaf; Kader, Ibrahim (Institute of Electrical and Electronics Engineering (IEEE), 2006)
      Overlay requirement is one of the biggest obstacles in achieving a very small feature. With the continued growth of small feature size, overlay requirement becomes tighter. Such a tight requirement requires a very high ...

    • Dual frequency integrated antenna (DFIA) with image rejection 

      Widad, Ismail; Sohiful Anuar, Zainol Murad (Institute of Electrical and Electronics Engineers (IEEE), 2005)
      A new configuration of integrated antenna featuring dual frequency operations and image frequency rejection is implemented. The used of dual frequency for image rejection in one system by using one antenna is a new technique ...

    • High-sensitivity pressure sensor using a polymer-embedded FBG 

      H., Ahmad; S. W., Harun; W. Y., Chong; M. Z., Zulkifli; M. M. M., Thant; Z., Yusof; Prabakaran, Poopalan (Wiley Periodicals, Inc., 2008-01)
      A new pressure sensor based on fiber Bragg gratings (FBG), is described with high-pressure sensitivity. The sensor is configured by embedding the FBG in a polymer-field aluminum casing with an opening on one side, which ...

    • Degradation of single layer MEH-PPV organic light emitting diode (OLED) 

      Nurjuliana, Juhari; Wan Haliza, Abd. Majid; Zainol Abidin, Ibrahim (Institute of Electrical and Electronics Engineering (IEEE), 2006)
      The degradation process of a single layer electroluminescence (EL) polymer MEH-PPV organic light emitting diode (OLED) with the MEH-PPV thickness of 57plusmn3 nm is discussed. Typical structure of OLED fabrication is ...

    • Alignment mark architecture effect on alignment signal behavior in advanced lithography 

      Normah, Ahmad; Uda, Hashim; Mohd Jeffrey, Manaf; Kader Ibrahim, Abdul Wahab (Institute of Electrical and Electronics Engineering (IEEE), 2006)
      The downscaling of CMOS technology becomes a challenge to the scanner alignment system since overlay and alignment accuracy becomes tighter. Such a tight overlay requirement requires a very stable alignment performance. A ...

    • Optical investigations using ultra-soft pseudopotential calculations of Si0.5Ge0.5 alloy 

      Y., Al-Douri; Y. P., Feng; A. C. H., Huan (Elsevier Ltd, 2008-12)
      Ultra-soft pseudopotential (US-PP) calculations with a powerful package called VASP (Vienna ab initio simulation package) are used. The total density of state and the energy gap of Si0.5Ge0.5 alloy of zinc-blende structure ...

    • FP-APW + lo calculations of the elastic properties in zinc-blende III-P compounds under pressure effects 

      A., Bouhemadou; R., Khenata; M., Kharoubi; Yarub K.A, Al Douri; T., Seddik; Ali H., Reshak (Elsevier B.V., 2009-04)
      The effect of high-pressures on the structural and elastic properties of XP zinc-blende compounds, with X = B, Al, Ga and In, has been investigated using the full-potential augmented plane wave plus local orbitals method ...

    • GaN Schottky barrier photodiode on Si (1 1 1) with low-temperature-grown cap layer 

      Chuah, Lee Siang; Z., Hassan; H., Abu Hassan; Naser Mahmoud, Ahmed (Elsevier B.V., 2009-07)
      In this work, GaN films were grown on three-inch silicon substrates by plasma-assisted molecular beam epitaxy (PAMBE) with AlN (about 200 nm) as the buffer layer. Finally, a thin AlN cap layer (50 nm) was grown on the GaN ...

    • Design and fabrication of Microfluidic devices: MOSFET & Capacitor 

      Osman, R. A.; Esa, S. R.; Prabakaran, Poopalan (Institute of Electrical and Electronics Engineers (IEEE), 2006)
      Microfluidic devices, based on silicon, are fabricated by photolithography, wet chemical etching with focus on an liquid conduction channel n-channel depletion MOSFET and a silica-liquid dielectric capacitor. Masks for ...

    • Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor 

      Mohd Khairuddin, Md Arshad; Uda, Hashim; Choo, C.M. (Institute of Electrical and Electronics Engineering (IEEE), 2006)
      In this paper we report the characterizations results of Serial Peripheral Interface (SPI) timing parameters for optical mouse sensor. SPI is an interface that facilitates the transfer of synchronous serial data. It supports ...

    • The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM 

      Mohd Khairuddin, Md Arshad; Mohd Nazrin, Md Isa; Sohiful Anuar, Zainol Murad (American Institute of Physics, 2007-05-09)
      This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond ...

    • Surface state on first-order ferroelectrics 

      Junaidah, Osman; Tilley, David Reginald; Rosy, Teh; Ishibashi, Y.; Mohamad Nazri, Abdul Halif; Khian, Hooi Chew (Springer Berlin / Heidelberg, 2006)
      In the presence of a surface the Landau-Devonshire equations of ferroelectricity must be extended to include a boundary condition. For a ferroelectric with a second-order transition in the case when the polarization p(z) ...

    • A voltage reference circuit for current source of RFIC blocks 

      Marzuki, Arjuna; Zaliman, Sauli; Ali Yeon, Md Shakaff (Emerald Group Publishing Limited, 2008)
      Purpose - The purpose of this paper is to design a voltage reference circuit for current source of radio frequency integrated circuit blocks. The voltage reference circuit is called voltage for current source (VCS). ...

    • Electronic properties of orthorhombic LiGaS2 and LiGaSe 2 

      Reshak, Ali H.; Auluck, S.; Kityk, I. V.; Yarub K.A, Al-Douri; Khenata, R.; Bouhemadou, A. (Springer Berlin/Heidelberg, 2009)
      We report theoretical calculations of the band structure and density of states for orthorhombic LiGaS2 (LGS) and LiGaSe2 (LGSe). These calculations are based on the full potential linear augmented plane wave (FP-LAPW) ...

    • Monitoring System for uninterruptible power supply 

      Sohiful Anuar, Zainol Murad; Mohd Nazrin, Md Isa; Norazeani, Abdul Rahman (Science Publications, 2007)
      In industrial process today, reliability of equipment is very important. Power supply must be able to cater the need of industrial process. In case of power failure, backup power supply system must be able to support the ...

    • Uninterruptible power supply monitoring system with Visual Basic 

      Sohiful Anuar, Zainol Murad; Mohd Nazrin, Md Isa; Norazeani, Abdul Rahman (Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2006-12-29)
      In industrial process today, reliability of equipment is very important. Power supply must be able to cater the need of industrial process. In case of power failure, backup power supply system must be able to support the ...

    • Oscillatory dynamical switching system of bulk ferroelectrics 

      Mohamad Nazri, Abdul Halif; S. Daud; Junaidah Osman (Science Publications, 2005)
      This study gives a detailed account of calculation of the bulk ferroelectric (FE) oscillatory dynamical system switching for first and second-order phase transition, respectively. All the formalism is delineated in the ...

    • Far-infrared optical transmission through asymmetrical ferroelectric films 

      Mohamad Nazri, Abdul Halif (Research India Publications, 2005)
      Investigation of far-infrared (FIR) spectroscopy for symmetrical ferroelectric (FE) films are discussed theoretically based on the basis of the Tilley-Zeks (TZ) model using Landau free energy expansion, Landau- Khalatnikov ...

    • The physics of Tsunami: basic understanding of the Indian Ocean disaster 

      Mohamad Nazri, Abdul Halif; Sharifah Norfaezah, Sabki (Science Publications, 2005)
      This study gives a simple physics explanation behind the Indian Ocean earthquake, called December 26th‘s Tsunami. The explanation based on physics energy conservation and wave properties have been used to understand this ...

    • Under Bump Metallurgy (UBM)-a technology review for flip chip packaging 

      Mohd Khairuddin Md Arshad; Uda Hashim; Muzamir Isa (Department of Mechanical Engineering, University Malaya, 2007)
      Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ...