School of Microelectronic Engineering (Articles): Recent submissions

Now showing items 181-183 of 183

    • The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition 

      Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar (Elsevier Science, 2006)
      This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ...

    • FPGA based SPWM Bridge Inverter 

      Mohd Nazrin, Md Isa; Muhammad Imran, Ahmad; Sohiful Anuar, Zainol Murad; Mohd Khairuddin, Md Arshad (Science Publications, 2007)
      This study presents methodology to generate sinusoidal pulse width modulation (SPWM) signal using Field Programmable Gate Array, FPGA technology. We discussed the unipolar switching scheme and the methodology to generate ...

    • The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition 

      Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar (Science Publications, 2007)
      This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ...