School of Microelectronic Engineering (Articles): Recent submissions
Now showing items 181-185 of 185
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The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ... -
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
(Elsevier Science, 2006)This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ... -
FPGA based SPWM Bridge Inverter
(Science Publications, 2007)This study presents methodology to generate sinusoidal pulse width modulation (SPWM) signal using Field Programmable Gate Array, FPGA technology. We discussed the unipolar switching scheme and the methodology to generate ... -
The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
(Science Publications, 2007)This study reports a number of experiments that were designed to characterize aluminum bond pad surfaces prior to electroless nickel immersion gold (ENIG). In the ENIG process, aluminum bond pads need special treatment ...