Browsing School of Microelectronic Engineering (Theses) by Title
Now showing items 56-57 of 57
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Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2008)Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize ... -
Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor
In development of the die stacking interconnection technology, the thermal analysis on stacked dies are commonly engaged in semiconductor products. However, thermal issues are not the main criteria for stack die configuration ...