Browsing School of Microelectronic Engineering (Theses) by Title
Now showing items 48-57 of 57
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Silicon nanowire sensor from electron beam lithography: design, fabrication and characterization
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2011)This study demonstrates the process development of silicon nanowires (SiNWs) sensor requires both the fabrication of nanoscale diameter wires and standard integration to CMOS process. Prior to actual fabrication process, ... -
SOA-NOLM based and, XOR, parity generator and checker
All-optical systems are attractive in signal processing for digital logics due to its higher bandwidth than the conventional electronic based circuits. Researches have shown that photonic integrated circuits might replace ... -
Sol-gel BST thin films for FeFET applications : fabrication and characterization
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2012)The effect of the chemical composition and film thickness of the ferroelectric barium strontium titanate (BST) at the memory window behavior of Al/BST/SiO2/Si-Gatefield effect transistor structure has been investigated. ... -
Stability and degradation factors of natural dyes as photosensitizer in solar cell
Solar cell is the most potential power sources as a clean and inexhaustible source that utilize solar radiation. However, the solar cell technology is facing several issues regarding the long term stability which need to ... -
A study of multilayer solar cells performances using gallium arsenide (gaAs) and silicon (Si)
The present low efficiency of solar cells is due to the incomplete use of the solar spectrum. Since different semiconductor materials have different band gaps, it responds separately to different parts of the solar spectrum ... -
Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2013)The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element ... -
Surface roughness and wettability investigation of varied plasma parameter effect on PVD deposited aluminium
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2013)Surface metrology has been a focused and thoroughly investigated research niche since the advent of device fabrication. The current technology shift into MEMS and nano has again made surface metrology a focused area. Layer ... -
Synthesis and characterization of high dielectric constant material based on Er-doped BaTiO3 for capacitor applications
High dielectric constant material becomes an important parameter to be used as capacitor for storage in most electronic devices due to miniaturization trend of smart devices and electronic gadgets. BaTiO3 was used in ... -
Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2008)Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize ... -
Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor
In development of the die stacking interconnection technology, the thermal analysis on stacked dies are commonly engaged in semiconductor products. However, thermal issues are not the main criteria for stack die configuration ...