Browsing School of Microelectronic Engineering (Theses) by Title
Now showing items 38-57 of 57
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MEMS piezoresistive accelerometer sensor for gait analysis
Microelectromechanical Systems (MEMS) based accelerometers have been reported as one of the most popular applications in sensing methods. For establishing the microsystem technology, Finite Element Analysis (FEA) has ... -
MEMS pressure sensor for gait analysis
Pressure sensor plays an important role in many applications, especially in gait analysis. The focus of this dissertation is to design a pressure sensor to be applied onto the shoe insole. The piezoelectric effect is ... -
Microchannel interrogation with twyman-green interferometer
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2011)The Twyman-Green Interferometer (TGI) setup for measuring microfluidic channel depth has been developed. The main objective of this study is to develop a non-contact measuring instrument capable of performing depth ... -
Multi-wavelength brillouin fiber laser by utilizing fiber bragg grating
A ring cavity multi-wavelength Brillouin fiber laser by utilizing fiber Bragg grating is evolved to increase the transmission or data rate in the optical fiber communication especially in dense wavelength division multiplexing ... -
A novel approach using optical fringe analysis for breast carcinoma detection
Breast carcinoma is one of the primary cancers diagnosed among woman with 25.1 % accounted of all cancers in women. Recognized methods for breast carcinoma detection and diagnosis include breast self examination (BSE), ... -
Numerical simulations of innovative ground plane and double-gate configurations in thin-body and -buried oxide of SOI MOSFETS
The downscaling of transistors enables an increased in transistor density, faster switching speeds and greater complexity with no increase in power consumption. However, the scaling of the conventional planar MOS transistors ... -
Optimization of line pattern transfer of integrated optical mach-zender interferometer for optical sensor
Conventional photolithography usually used in in-house fabrication process to transfer the design of line pattern. This research lays the foundation for the optimization of photo lithography process for line pattern transfer ... -
Physical and electrical characterization of sol-gel derived BaxSr1-xTiO3 thin films of various composition ratios and thicknesses
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2011)Among the various dielectric materials, barium strontium titanate has been extensively studied due to its high dielectric constant, low dielectric loss and high tunability. Barium strontium titanate is a composition ... -
Portable shoe integrated instrumentation for gait analysis measurement using mems based devices
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2013)Gait analysis measurement is a method to access and identify gait events and the measurements of dynamic and motion parameters involving the lower part of body. This significant method is widely used in sports, rehabilitation ... -
Preparation and characterization of bulk nanoporous Sn, SnO2 AND Zn
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2013)Extreme ultraviolet lithography (EUVL) has garnered much attention due to its potential in high-volume manufacturing (HVM) of integrated circuit (IC). This research contributes to the study of EUV source target. It has ... -
Silicon nanowire sensor from electron beam lithography: design, fabrication and characterization
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2011)This study demonstrates the process development of silicon nanowires (SiNWs) sensor requires both the fabrication of nanoscale diameter wires and standard integration to CMOS process. Prior to actual fabrication process, ... -
SOA-NOLM based and, XOR, parity generator and checker
All-optical systems are attractive in signal processing for digital logics due to its higher bandwidth than the conventional electronic based circuits. Researches have shown that photonic integrated circuits might replace ... -
Sol-gel BST thin films for FeFET applications : fabrication and characterization
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2012)The effect of the chemical composition and film thickness of the ferroelectric barium strontium titanate (BST) at the memory window behavior of Al/BST/SiO2/Si-Gatefield effect transistor structure has been investigated. ... -
Stability and degradation factors of natural dyes as photosensitizer in solar cell
Solar cell is the most potential power sources as a clean and inexhaustible source that utilize solar radiation. However, the solar cell technology is facing several issues regarding the long term stability which need to ... -
A study of multilayer solar cells performances using gallium arsenide (gaAs) and silicon (Si)
The present low efficiency of solar cells is due to the incomplete use of the solar spectrum. Since different semiconductor materials have different band gaps, it responds separately to different parts of the solar spectrum ... -
Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2013)The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element ... -
Surface roughness and wettability investigation of varied plasma parameter effect on PVD deposited aluminium
(Universiti Malaysia Perlis (UniMAP)School of Microelectronic Engineering, 2013)Surface metrology has been a focused and thoroughly investigated research niche since the advent of device fabrication. The current technology shift into MEMS and nano has again made surface metrology a focused area. Layer ... -
Synthesis and characterization of high dielectric constant material based on Er-doped BaTiO3 for capacitor applications
High dielectric constant material becomes an important parameter to be used as capacitor for storage in most electronic devices due to miniaturization trend of smart devices and electronic gadgets. BaTiO3 was used in ... -
Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2008)Thermal cycling test is one of the reliability test that has been used to evaluate the reliability of the solder joint interconnect in ball grid array (BGA) package. The purpose of thermal cycling test is to characterize ... -
Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor
In development of the die stacking interconnection technology, the thermal analysis on stacked dies are commonly engaged in semiconductor products. However, thermal issues are not the main criteria for stack die configuration ...