Browsing Uda Hashim, Prof. Ts. Dr. by Title
Now showing items 240-244 of 244
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Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
(Department of Mechanical Engineering, University Malaya, 2007)Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ... -
The usage of max 262 as a programmable low pass filter for nanogap automated permittivity measurement system
(Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)The Nanogap Automated Permittivity Measurement System (APMS) are fabricated for low cost, portable and label free DNA hybridization detection kit. The nanogap capacitor can react as a DNA sensor. The difference ... -
VIS-NIR spectral and particles distribution of Au, Ag, Cu, Al and Ni nanoparticles synthesized in distilled water using laser ablation
(Elsevier, 2019-07)In this research, gold (Au), silver (Ag), copper (Cu), aluminium (Al) and nickel (Ni) nanoparticles have been prepared by laser ablation in distilled water using Q-switched Nd: YAG. Comparative analysis between 1064 nm and ... -
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
(Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ... -
ZnO thin film deposition on butterfly shaped electrodes for ultravioletsensing applications
(Elsevier GmbH, 2013-12)ZnO thin film was deposited on patterned gold electrodes using sol-gel spin coating technique. Conven-tional photo-lithography with wet etching process was used to create butterfly shaped 13-m gap fromzero gap chrome mask. ...