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    Relationship between controllable process parameters on bump height in ENIG 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz (Trans Tech Publications, 2013)
    This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...
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    Analysis on surface roughness and surface reflectance through DOE 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ong, Tee Say (Trans Tech Publications, 2014)
    The Lambda 950 spectrometers are designed to investigate and examine surface coating on test specimen by using the light source. The objective of this research is to investigate the factors that affect the surface roughness ...
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    Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
    Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...
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    Surface roughness analysis on reactive ion etched aluminium deposited wafer 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014)
    This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF₄) and Oxygen (O₂) gaseous. A total of ...
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    Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
    This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...
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    Bump height at low temperature analysis 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
    The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
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    Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous 

    Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Aaron, Koay Terr Yeow; Goh, Siew Chui; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
    Wettability in microfluidic has direct influence to its fluid flow channels. This paper investigates the variable parameters that affect the wetability in terms of contact angle on a Platinum deposited wafer after reactive ...

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    AuthorRetnasamy, Vithyacharan (7)Zaliman, Sauli, Dr. (7)Aaron, Koay Terr Yeow (4)Ehkan, Phaklen, Dr. (2)Fairul Afzal, Ahmad Fuad (2)... View MoreSubject
    DOE (7)
    Platinum (3)Reactive Ion Etching (RIE) (3)Surface roughness (3)Bump height (2)... View MoreDate Issued2014 (4)2013 (3)

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