We present a density functional theory which connects nuclear matter equation of state, which incorporates clustering at low densities, with clustering in medium and heavy nuclei at the nuclear surface. This explains the ...

Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...

Nowdays Barium strontium titanate (BST) can be applied into many fields of engineering. Its properties attracted more researchers to research and apply it into many fields of study. In this work, sol-gel method of preparing ...

This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...

This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...

Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...

Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ...

The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ...

We demonstrate that the binding energy per nucleon of symmetric nuclear matter (SNM) (with Coulomb interaction switched off and N Z) in the limit of zero density approaches to its value, uv, at the saturation density, where ...

As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ...