Vithyacharan Retnasamy : [54] Collection home page

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This page provides access to research works by Vithyacharan Retnasamy, currently a Senior Lecturer of School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP).

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Collection's Items (Sorted by Submit Date in Descending order): 41 to 54 of 54
Issue DateTitleAuthor(s)
Dec-2012Wire bond shear test simulation on sharp groove surface bond padZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran; vc.sundress@gmail.com
Dec-2012Polymer core BGA stress analysis at minimal vertical loadingZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Steven, Taniselass; Norazeani, Abdul Rahman; Muhamad Hafiz, Ab Aziz; zaliman@unimap.edu.my
Dec-2012Shear ram height investigation for gold wire bond shear testZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Taniselass, Steven; Ong, T.S.; zaliman@unimap.edu.my
Dec-2012Wire bond shear test simulation on hemispherical surface bond padZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj; W.M.W. Norhaimi, J. Adnan, M. Palianysamy; vc.sundress@gmail.com
18-Jun-2012Simulation and characterization of MEMS piezoelectric thermal actuatorPalianysamy, Moganraj; Raman, Sathisvaran; Hasnizah, Aris; Retnasamy, Vithyacharan; dravid87@hotmail.com; hasnizah@unimap.edu.my
18-Jun-2012Wire bond shear test simulationVairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi; rajendaran@gmail.com; zaliman@unimap.edu.my; rcharan@unimap.edu.my; steven@unimap.edu.my; wanmokhdzani@unimap.edu.my
Sep-2012Silica microchannel fabrication using fluorine based rie with alas a maskWan Mokhzani, Wan Norhaimi; Retnasamy, Vithyacharan; Zaliman, Sauli, Assoc. Prof. Dr.; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Abdul Halis, Abdul Aziz; wanmokhdzani@unimap.edu.my
2012Shear ram speed characterization for copper wire bond shear testZaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Ahmad Husni, Mohd Shapri; Norazeani, Abdul Rahman; Wan Mokhzani, Wan Norhaimi; Taniselass, Steven; Abdul Halis, Abdul Aziz; zaliman@unimap.edu.my; vc.sundres@gmail.com
Jul-2013Microfluidic channel depth determination with Tywman-Green interferometerWan Mokhdzani, Wan Nor Haimi; Zaliman, Sauli, Prof. Madya Dr.; Retnasamy, Vithyacharan; Taniselass, S.; N., Ramli; M. H. A. Aziz; R., Hatta; wanmokhdzani@unimap.edu.my
16-Oct-2010Micro-reservoir depth determination with Twyman-Green InterferometerWan Mokhdzani, Wan Nor Haimi; Poopalan, Prabakaran, Assoc. Prof. Dr.; Retnasamy, Vithyacharan; Mohd Naim, Haron; belg85@yahoo.com
16-Oct-2010Velocity profiles and friction factor analysis of liquid flow in microstructured microchannelTaniselass, S.; S. S., Najamudin; Retnasamy, Vithyacharan; Poopalan, Prabakaran, Assoc. Prof. Dr.; stevej2j77@yahoo.com
2011Microchannel miter bend effects on pressure equalization and vortex formationTaniselass, S.; Retnasamy, Vithyacharan; Poopalan, Prabakaran, Prof. Madya Dr.; stevej2j77@yahoo.com; prabakaran@unimap.edu.my
3-Oct-2010Phase-map fringe pixel tracing for height computationRetnasamy, Vithyacharan; Poopalan, Prabakaran, Assoc. Prof. Dr.; vc.sundres@gmail.com
19-May-2006Heart Caring "Handy" - PrototypeRetnasamy, Vithyacharan; R., Vijenthi; Sazali, Yaacob, Prof. Dr.; R., Nagarajan; Rizon, Juhari; Kenneth, Sundaraj; Shukry, Abd. Majid; Mohamad Hanif, Abd Hamid; rcharan@unimap.edu.my
Collection's Items (Sorted by Submit Date in Descending order): 41 to 54 of 54
Skills and Expertise:Thin Films and Nanotechnology,Stress Analysis,Nanoelectronics Electronic Engineering,Semiconductor,Microelectronics and Semiconductor Engineering Microelectronics,Industrial Engineering,Manufacturing Engineering,GaN,ANSYS Copper,Polymers & Microfluidics,LED,Grid,Light Emitting Diode,Soldering Microelectromechanical Systems (MEMS),Scopus,Machine Parameter Optimization Design of Experiments-Full facorial,Microfabrication Process Optimization and Semiconductor Packaging Process Optimization.