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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/32659| Title: | Shear ram height investigation for gold wire bond shear test |
| Authors: | Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Ahmad Husni, Mohd Shapri Taniselass, Steven Ong, T.S. zaliman@unimap.edu.my |
| Keywords: | Shear test Wirebond |
| Issue Date: | Dec-2012 |
| Publisher: | Trans Tech Publications |
| Citation: | Advanced Materials Research, vol.262-623, 2012, pages 1447-14450 |
| Abstract: | This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element model. The effects of the shear ram height on the stress and strain response of the gold ball bond were investigated. The results of the simulation confirms that shear ram height has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test. |
| Description: | Link to publisher's homepage at http://www.ttp.net/ |
| URI: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/32659 |
| ISSN: | 1662-8985 |
| Appears in Collections: | Steven Taniselass, Mr. Vithyacharan Retnasamy Zaliman Sauli, Lt. Kol. Professor Dr. School of Microelectronic Engineering (Articles) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Shear Ram Height Investigation for Gold Wire Bond Shear Test.pdf | 127.92 kB | Adobe PDF | View/Open |
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