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dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorAhmad Husni, Mohd Shapri-
dc.contributor.authorTaniselass, Steven-
dc.contributor.authorOng, T.S.-
dc.date.accessioned2014-03-13T03:51:02Z-
dc.date.available2014-03-13T03:51:02Z-
dc.date.issued2012-12-
dc.identifier.citationAdvanced Materials Research, vol.262-623, 2012, pages 1447-14450en_US
dc.identifier.issn1662-8985-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/32659-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThis paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element model. The effects of the shear ram height on the stress and strain response of the gold ball bond were investigated. The results of the simulation confirms that shear ram height has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectShear testen_US
dc.subjectWirebonden_US
dc.titleShear ram height investigation for gold wire bond shear testen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMR.622-623.1447-
dc.contributor.urlzaliman@unimap.edu.myen_US
Appears in Collections:Steven Taniselass, Mr.
Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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