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Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zaliman, Sauli, Dr. | - |
dc.contributor.author | Retnasamy, Vithyacharan | - |
dc.contributor.author | Ahmad Husni, Mohd Shapri | - |
dc.contributor.author | Taniselass, Steven | - |
dc.contributor.author | Ong, T.S. | - |
dc.date.accessioned | 2014-03-13T03:51:02Z | - |
dc.date.available | 2014-03-13T03:51:02Z | - |
dc.date.issued | 2012-12 | - |
dc.identifier.citation | Advanced Materials Research, vol.262-623, 2012, pages 1447-14450 | en_US |
dc.identifier.issn | 1662-8985 | - |
dc.identifier.uri | http://dspace.unimap.edu.my:80/dspace/handle/123456789/32659 | - |
dc.description | Link to publisher's homepage at http://www.ttp.net/ | en_US |
dc.description.abstract | This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element model. The effects of the shear ram height on the stress and strain response of the gold ball bond were investigated. The results of the simulation confirms that shear ram height has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Trans Tech Publications | en_US |
dc.subject | Shear test | en_US |
dc.subject | Wirebond | en_US |
dc.title | Shear ram height investigation for gold wire bond shear test | en_US |
dc.type | Article | en_US |
dc.identifier.url | http://www.scientific.net/AMR.622-623.1447 | - |
dc.contributor.url | zaliman@unimap.edu.my | en_US |
Appears in Collections: | Steven Taniselass, Mr. Vithyacharan Retnasamy Zaliman Sauli, Lt. Kol. Professor Dr. School of Microelectronic Engineering (Articles) |
Files in This Item:
File | Description | Size | Format | |
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Shear Ram Height Investigation for Gold Wire Bond Shear Test.pdf | 127.92 kB | Adobe PDF | View/Open |
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