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Results 1-10 of 18 (Search time: 0.0 seconds).
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Issue DateTitleAuthor(s)
2013Aluminium surface grain size analysis on RIE treatmentZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my
2013Relationship between controllable process parameters on bump height in ENIGZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; muhamadhafiz@unimap.edu.my
Oct-2013LED heat dissipation study using different Cu slug sizeVairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; vc.sundres@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013High power LED heat dissipation analysis via copper diamond slugVairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
Oct-2013Shear strain analysis in FSS microchannelZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nor Shakirina, Nadzri; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
Oct-2013Cylindrical shape slug heat conduction numerical analysis using copper materialZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my
2013Bump height at low temperature analysisZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass; zaliman@unimap.edu.my; rcharan@unimap.edu.my; fairul@unimap.edu.my; phaklen@unimap.edu.my; steven@unimap.edu.my
Oct-2013Numerical analysis of velocity profile in a FFS microchannelNor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; vc.sundress@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my
Oct-2013Heat dissipation analysis under natural convection condition on high power LEDVairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my
20135mm × 5mm sized slug on high power LED stress and junction temperature analysisZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; nazuhusna@unimap.edu.my

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