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Issue DateTitleAuthor(s)
2013Aluminium surface grain size analysis on RIE treatmentZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my
2013Relationship between controllable process parameters on bump height in ENIGZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; muhamadhafiz@unimap.edu.my
2013Bump height at low temperature analysisZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass; zaliman@unimap.edu.my; rcharan@unimap.edu.my; fairul@unimap.edu.my; phaklen@unimap.edu.my; steven@unimap.edu.my
20135mm × 5mm sized slug on high power LED stress and junction temperature analysisZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; nazuhusna@unimap.edu.my
2013Shear speed analysis on Sn-3.9Ag-0.6Cu SolderZaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my

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