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Issue DateTitleAuthor(s)
Jul-2013A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsMohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro; arifanuar@unimap.edu.my; mustafa_albakri@unimap.edu.my; sav@tuiasi.ro; norainiza@unimap.edu.my; kamarudin@unimap.edu.my; s.mcdonald1@uq.edu.au; k.nogita@uq.edu.au
2013Zn-Sn based high temperature solder - A short reviewSayyidah Amnah, Musa; Mohd Arif Anuar, Mohd Salleh; Norainiza, Saud; arifanuar@unimap.edu.my; norainiza@unimap.edu.my
2014Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solderNorainiza, Saud; Najib Saedi, Ibrahim; Mohd Arif Anuar, Mohd Salleh; norainiza@unimap.edu.my; najib8789@gmail.com; arifanuar@unimap.edu.my
2016An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste compositeNorainiza, Saud; Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul Izwan, Ramli; Norhayanti, Mohd Nasir; norainiza@unimap.edu.my
Oct-2016Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite SolderMohd Izrul Izwan, Ramli; ‪Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Rita, Mohd Said; Norainiza, Saud; mohdizrulizwan@gmail.com
Feb-2021Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageingNur Syahirah, Mohamad Zaimi; Mohd Arif Anuar, Mohd Salleh; Sandu, Andrei Victor; Mohd Mustafa Al Bakri, Abdullah; Norainiza, Saud; Shayfull Zamree, Abd Rahim; Vizureanu, Petrica; Rita, Mohd Said; Mohd Izrul, Izwan Ramli; Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP); Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP); Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi; Faculty of Mechanical Engineering Technology, Universiti Malaysia Perlis (UniMAP); arifanuar@unimap.edu.my; sav@tuiasi.ro; peviz@tuiasi.ro
Feb-2021The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder jointMohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin; Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP); Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP); Department of Physics, Czestochowa University of Technology; arifanuar@unimap.edu.my

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