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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728
Title: Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Authors: Mohd Izrul Izwan, Ramli
‪Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Rita, Mohd Said
Norainiza, Saud
mohdizrulizwan@gmail.com
Keywords: Activated Carbon (AC)
Intermetallic compound
Solder
Issue Date: Oct-2016
Publisher: EDP Sciences
Citation: MATEC Web Conferences, vol.78, 2016, 7 pages
Series/Report no.: 2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016);
Abstract: The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.
Description: Link to publisher's homepage at https://www.matec-conferences.org/
URI: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728
ISSN: 2261-236X (online)
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
Mohd Nazree Derman, Assoc. Prof. Dr.

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