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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728
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dc.contributor.authorMohd Izrul Izwan, Ramli-
dc.contributor.author‪Mohd Arif Anuar, Mohd Salleh-
dc.contributor.authorMohd Nazree, Derman-
dc.contributor.authorRita, Mohd Said-
dc.contributor.authorNorainiza, Saud-
dc.date.accessioned2020-11-16T04:23:43Z-
dc.date.available2020-11-16T04:23:43Z-
dc.date.issued2016-10-
dc.identifier.citationMATEC Web Conferences, vol.78, 2016, 7 pagesen_US
dc.identifier.issn2261-236X (online)-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728-
dc.descriptionLink to publisher's homepage at https://www.matec-conferences.org/en_US
dc.description.abstractThe influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength.en_US
dc.language.isoenen_US
dc.publisherEDP Sciencesen_US
dc.relation.ispartofseries2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016);-
dc.subjectActivated Carbon (AC)en_US
dc.subjectIntermetallic compounden_US
dc.subjectSolderen_US
dc.titleInfluence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solderen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1051/matecconf/20167801064-
dc.contributor.urlmohdizrulizwan@gmail.comen_US
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
Mohd Nazree Derman, Assoc. Prof. Dr.

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