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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/35751| Title: | A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods |
| Authors: | Mohd Arif Anuar, Mohd Salleh Mohd Mustafa Al Bakri, Abdullah Sandu, Andrei Victor Norainiza, Saud Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. McDonald, Stuart D. Nogita, Kazuhiro arifanuar@unimap.edu.my mustafa_albakri@unimap.edu.my sav@tuiasi.ro norainiza@unimap.edu.my kamarudin@unimap.edu.my s.mcdonald1@uq.edu.au k.nogita@uq.edu.au |
| Keywords: | Intermetallics Mechanical Microstructure Powder metallurgy Solder Wettability |
| Issue Date: | Jul-2013 |
| Publisher: | Syscom 18 SRL |
| Citation: | Revista de Chimie vol. 64(7), 2013, pages 725-728 |
| Abstract: | The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting Sn-0.7Cu solder bulks. PM Sn-0.7Cu solder showed denser and finer Sn-grain structure, while cast Sn-0.7Cu showed larger Sn-rich dendrites with the presence of eutectic phase region. The mechanical performance of the solder bulk prepared with the PM technique was enhanced as it had higher microhardness value, UTS, and yield strength compared to the solder bulk prepared using the casting method. The solder wettability of the product was also increased using the PM method. Overall, the PM method can improve the mechanical and solderability properties of lead-free solder; therefore, it holds great potential as a new method for solder fabrication. |
| Description: | Link to publisher's homepage at http://syscom.ro/ |
| URI: | http://www.revistadechimie.ro/article_eng.asp?ID=3718 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35751 |
| ISSN: | 0034-7752 |
| Appears in Collections: | Norainiza Saud, Ts Dr. Mohd Mustafa Al Bakri Abdullah, Prof. Dr. Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. Kamarudin Hussin, Brig. Jen. Datuk Prof. Dr. |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods-abstrct.pdf | 58.82 kB | Adobe PDF | View/Open | |
| A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods-e.pdf | Access is limited to UniMAP community | 236.38 kB | Adobe PDF | View/Open |
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