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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34509| Title: | Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder |
| Authors: | Norainiza, Saud Najib Saedi, Ibrahim Mohd Arif Anuar, Mohd Salleh norainiza@unimap.edu.my najib8789@gmail.com arifanuar@unimap.edu.my |
| Keywords: | Growth kinetics Intermetallic Ostwald ripening |
| Issue Date: | 2014 |
| Publisher: | Trans Tech Publications |
| Citation: | Key Engineering Materials, vol.594-595, 2014, pages 666-670 |
| Abstract: | The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound (IMC) growth during low and high temperature aging. 50°C and 150°C represent low and high aging temperature respectively. Various isothermal of aging times were carried out by using 24hrs, 240hrs and 720hrs. The IMC thickness increases with increasing of aging temperature and time. Cu6Sn5 phase appear at low aging temperature whilst Cu6Sn5 together with Cu3Sn phases has been observed at high aging temperature. The growth kinetics for low and high aging temperature is 1.63x10⁻¹⁸μm2/s and 2.75 x10⁻¹⁸μm2/s. |
| Description: | Link to publisher's homepage at http://www.ttp.net/ |
| URI: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34509 |
| ISSN: | 1662-9795 |
| Appears in Collections: | Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. Norainiza Saud, Ts Dr. Center of Excellence for Geopolymer and Green Technology (CEGEOGTECH) (Articles) School of Materials Engineering (Articles) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder.pdf | 332.52 kB | Adobe PDF | View/Open |
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