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dc.contributor.authorNorainiza, Saud-
dc.contributor.authorNajib Saedi, Ibrahim-
dc.contributor.authorMohd Arif Anuar, Mohd Salleh-
dc.date.accessioned2014-05-19T08:43:27Z-
dc.date.available2014-05-19T08:43:27Z-
dc.date.issued2014-
dc.identifier.citationKey Engineering Materials, vol.594-595, 2014, pages 666-670en_US
dc.identifier.issn1662-9795-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34509-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThe effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound (IMC) growth during low and high temperature aging. 50°C and 150°C represent low and high aging temperature respectively. Various isothermal of aging times were carried out by using 24hrs, 240hrs and 720hrs. The IMC thickness increases with increasing of aging temperature and time. Cu6Sn5 phase appear at low aging temperature whilst Cu6Sn5 together with Cu3Sn phases has been observed at high aging temperature. The growth kinetics for low and high aging temperature is 1.63x10⁻¹⁸μm2/s and 2.75 x10⁻¹⁸μm2/s.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectGrowth kineticsen_US
dc.subjectIntermetallicen_US
dc.subjectOstwald ripeningen_US
dc.titleLow and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solderen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/KEM.594-595.666-
dc.identifier.doi10.4028/www.scientific.net/KEM.594-595.666-
dc.contributor.urlnorainiza@unimap.edu.myen_US
dc.contributor.urlnajib8789@gmail.comen_US
dc.contributor.urlarifanuar@unimap.edu.myen_US
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
Norainiza Saud, Ts Dr.
Center of Excellence for Geopolymer and Green Technology (CEGEOGTECH) (Articles)
School of Materials Engineering (Articles)

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