UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Statistics
Total Visits
| Views | |
|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 159 |
Total Visits per Month
| October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | |
|---|---|---|---|---|---|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 7 | 4 | 11 | 7 | 7 | 1 | 2 |
File Downloads
| Views | |
|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder.pdf | 39 |
Top Country Views
| Views | |
|---|---|
| United States | 74 |
| Ireland | 15 |
| China | 7 |
| Sweden | 7 |
| United Kingdom | 5 |
| Australia | 4 |
| Japan | 4 |
| Malaysia | 4 |
| Russia | 4 |
| Germany | 3 |
Top City Views
| Views | |
|---|---|
| San Mateo | 17 |
| Dublin | 15 |
| Boardman | 6 |
| Hangzhou | 4 |
| Seattle | 4 |
| Ashburn | 3 |
| Hanoi | 3 |
| Mersin | 2 |
| Mountain View | 2 |
| Odesa | 2 |