UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Statistics
Total Visits
| Views | |
|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 237 |
Total Visits per Month
| May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | October 2025 | November 2025 | |
|---|---|---|---|---|---|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 1 | 6 | 8 | 12 | 41 | 5 | 2 |
File Downloads
| Views | |
|---|---|
| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder.pdf | 55 |
Top Country Views
| Views | |
|---|---|
| United States | 129 |
| Ireland | 15 |
| China | 11 |
| Brazil | 7 |
| Sweden | 7 |
| United Kingdom | 5 |
| Japan | 5 |
| Malaysia | 5 |
| Australia | 4 |
| Russia | 4 |
Top City Views
| Views | |
|---|---|
| San Mateo | 20 |
| Dublin | 15 |
| Boardman | 6 |
| Hangzhou | 4 |
| Seattle | 4 |
| Ashburn | 3 |
| Hanoi | 3 |
| Mersin | 2 |
| Mountain View | 2 |
| Odesa | 2 |