An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite

Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170

Title:	An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
Authors:	Norainiza, Saud Rita, Mohd Said Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Mohd Izrul Izwan, Ramli Norhayanti, Mohd Nasir norainiza@unimap.edu.my
Keywords:	Titanium oxide (TiO2) Solder
Issue Date:	2016
Publisher:	EDP Sciences
Citation:	MATEC Web Conferences, vol.78, 2016, 5 pages
Series/Report no.:	2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016);
Abstract:	In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further
Description:	Link to publisher's homepage at https://www.matec-conferences.org/
URI:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170
ISSN:	2261-236X (online)
Appears in Collections:	Norainiza Saud, Ts Dr. Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. Mohd Nazree Derman, Assoc. Prof. Dr.

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