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dc.contributor.authorNorainiza, Saud-
dc.contributor.authorRita, Mohd Said-
dc.contributor.authorMohd Arif Anuar, Mohd Salleh-
dc.contributor.authorMohd Nazree, Derman-
dc.contributor.authorMohd Izrul Izwan, Ramli-
dc.contributor.authorNorhayanti, Mohd Nasir-
dc.date.accessioned2020-12-30T01:56:44Z-
dc.date.available2020-12-30T01:56:44Z-
dc.date.issued2016-
dc.identifier.citationMATEC Web Conferences, vol.78, 2016, 5 pagesen_US
dc.identifier.issn2261-236X (online)-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170-
dc.descriptionLink to publisher's homepage at https://www.matec-conferences.org/en_US
dc.description.abstractIn this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed furtheren_US
dc.language.isoenen_US
dc.publisherEDP Sciencesen_US
dc.relation.ispartofseries2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016);-
dc.subjectTitanium oxide (TiO2)en_US
dc.subjectSolderen_US
dc.titleAn investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste compositeen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1051/matecconf/20167801070-
dc.contributor.urlnorainiza@unimap.edu.myen_US
Appears in Collections:Norainiza Saud, Ts Dr.
Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
Mohd Nazree Derman, Assoc. Prof. Dr.

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