| Issue Date | Title | Author(s) |
| 2013 | 5mm × 5mm sized slug on high power LED stress and junction temperature analysis | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my; nazuhusna@unimap.edu.my |
| Jan-2014 | CuDia slug size variation analysis on heat dissipation of high power LED | Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; vc.sundress@gmail.com |
| Oct-2013 | Cylindrical shape slug heat conduction numerical analysis using copper material | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; vc@unimap.edu.my |
| Oct-2013 | Heat dissipation analysis under natural convection condition on high power LED | Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my |
| Jan-2014 | Heat sink fin number variation analysis on single chip high power LED | Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan; zaliman@unimap.edu.my |
| Oct-2013 | High power LED heat dissipation analysis via copper diamond slug | Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; zaliman@unimap.edu.my; vc.sundres@gmail.com; vc@unimap.edu.my |
| Feb-2014 | LED heat dissipation analysis using composite based cylindrical slug | Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan; zaliman@unimap.edu.my |
| Oct-2013 | LED heat dissipation study using different Cu slug size | Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; rajendaran@gmail.com; vc.sundres@gmail.com; zaliman@unimap.edu.my; vc@unimap.edu.my |
| Jan-2014 | Natural heat convection analysis on cylindrical Al slug of LED | Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah; Nazuhusna, Khalid; zaliman@unimap.edu.my |
| Jan-2014 | Operating temperature analysis of LED with cylindrical Cu slug | Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; zaliman @unimap.edu.my |
| 2013 | Shear speed analysis on Sn-3.9Ag-0.6Cu Solder | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran; zaliman@unimap.edu.my; vc.sundress@gmail.com; fairul@unimap.edu.my; phaklen@unimap.edu.my |
| 18-Jun-2012 | Wire bond shear test simulation | Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Wan Mokhzani, Wan Norhaimi; rajendaran@gmail.com; zaliman@unimap.edu.my; rcharan@unimap.edu.my; steven@unimap.edu.my; wanmokhdzani@unimap.edu.my |
| Dec-2012 | Wire bond shear test simulation on sharp groove surface bond pad | Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Taniselass, Steven; Ahmad Husni, Mohd Shapri; Vairavan, Rajendaran; vc.sundress@gmail.com |
