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Browsing by Author Mohd Khairuddin, Md Arshad
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Showing results 12 to 17 of 17
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Issue Date
Title
Author(s)
14-Mar-2011
Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices
S., Makovejev
;
V., Kilchytska
;
Mohd Khairuddin, Md Arshad
;
D., Flandre
;
F., Andrieu
;
O., Faynot
;
S., Olsen
;
J. P., Raskin
2006
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
Mohd Khairuddin, Md Arshad
;
Ibrahim, Ahmad
;
Azman, Jalar
;
Ghazali, Omar
9-May-2007
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
Mohd Khairuddin, Md Arshad
;
Mohd Nazrin, Md Isa
;
Sohiful Anuar, Zainol Murad
17-Mar-2009
Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
Mohd Khairuddin, Md Arshad
;
Lim, Moy Fung
;
Uda, Hashim
;
Zaliman, Sauli
Apr-2012
Ultra-thin body and thin-BOX SOI CMOS technology analog figures of merit
Kilchytska, Valeria I.
;
Mohd Khairuddin, Md Arshad
;
Makovejev, Sergej
;
Olsen, Sarah H.
;
Andrieu, Francois
;
Poiroux, Thierry
;
Faynot, Olivier
;
Raskin, Jean Pierre
;
Flandre, Denis
;
valeriya.kilchytska@uclouvain.be
;
mohd.khairuddin@unimap.edu.my
Jun-2006
Wafer bumping: A comparative technologies study
Mohd Khairuddin, Md Arshad