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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/6615| Title: | The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM |
| Authors: | Mohd Khairuddin, Md Arshad Mohd Nazrin, Md Isa Sohiful Anuar, Zainol Murad |
| Keywords: | Electroless nickel immersion gold (ENIG) Scanning electron microscope (SEM) Under bump metallurgy (UBM) Surface morphology Surface roughness Zincation Electroless deposition |
| Issue Date: | 9-May-2007 |
| Publisher: | American Institute of Physics |
| Citation: | AIP Conf. Proc., p.118-123 |
| Series/Report no.: | Proceedings of the 2nd International Conference on Solid State Science and Technology 2006 (ICSSST 2006) |
| Abstract: | This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer. |
| Description: | Link to publisher's homepage at http://link.aip.org/link/?APCPCS/909/118/1 |
| URI: | http://link.aip.org/link/?APCPCS/909/118/1 http://dspace.unimap.edu.my/123456789/6615 |
| Appears in Collections: | School of Microelectronic Engineering (Articles) |
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