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dc.contributor.authorMohd Khairuddin, Md Arshad-
dc.contributor.authorMohd Nazrin, Md Isa-
dc.contributor.authorSohiful Anuar, Zainol Murad-
dc.date.accessioned2009-07-29T08:40:10Z-
dc.date.available2009-07-29T08:40:10Z-
dc.date.issued2007-05-09-
dc.identifier.citationAIP Conf. Proc., p.118-123en_US
dc.identifier.urihttp://link.aip.org/link/?APCPCS/909/118/1-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/6615-
dc.descriptionLink to publisher's homepage at http://link.aip.org/link/?APCPCS/909/118/1en_US
dc.description.abstractThis paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond pad, followed by cleaning, activation, first zincation, zinc removal, second zincation, electroless nickel and lastly immersion gold process. The result shows that the surface morphology of initial bond pad starts to change with deposition of zinc layer and further changes with deposition of nickel and gold layer.en_US
dc.language.isoenen_US
dc.publisherAmerican Institute of Physicsen_US
dc.relation.ispartofseriesProceedings of the 2nd International Conference on Solid State Science and Technology 2006 (ICSSST 2006)en_US
dc.subjectElectroless nickel immersion gold (ENIG)en_US
dc.subjectScanning electron microscope (SEM)en_US
dc.subjectUnder bump metallurgy (UBM)en_US
dc.subjectSurface morphologyen_US
dc.subjectSurface roughnessen_US
dc.subjectZincationen_US
dc.subjectElectroless depositionen_US
dc.titleThe surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEMen_US
dc.typeArticleen_US
Appears in Collections:School of Microelectronic Engineering (Articles)

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