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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/9705| Title: | Wafer bumping: A comparative technologies study |
| Authors: | Mohd Khairuddin, Md Arshad |
| Keywords: | Environ -- Penerbitan Universiti UniMAP -- Publications UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar UniMAP -- Research and development Under bump metallurgy (UBM) Wafer bumping |
| Issue Date: | Jun-2006 |
| Publisher: | Universiti Malaysia Perlis (UniMAP) |
| Citation: | p.4-5 |
| Series/Report no.: | Explore June 2006 |
| URI: | http://dspace.unimap.edu.my/123456789/9705 |
| ISSN: | 1823-9633 |
| Appears in Collections: | Publications |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| wafer bumping.pdf | 1.11 MB | Adobe PDF | View/Open |
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