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Browsing by Author Mohd Khairuddin, Md Arshad

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Issue Date	Title	Author(s)
2016	Microwave irradiation assisted synthesis of silicon carbide nanotubes	Tony, V.; Voon, C.H.; Lee, Chang Chuan, Dr; Lim, B.Y.; Rahman, W.; Uda, Hashim; Ruslinda, Abdul Rahim; Mohd Khairuddin, Md Arshad; Foo, Kai Loong; Gopinath, S.C.B. ,; Ayoib, A. ,; Thivina, V. ,; Ba Hashwan, S.S.
14-Mar-2011	Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices	S., Makovejev; V., Kilchytska; Mohd Khairuddin, Md Arshad; D., Flandre; F., Andrieu; O., Faynot; S., Olsen; J. P., Raskin
2006	The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition	Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar
9-May-2007	The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM	Mohd Khairuddin, Md Arshad; Mohd Nazrin, Md Isa; Sohiful Anuar, Zainol Murad
17-Mar-2009	Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad	Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Uda, Hashim; Zaliman, Sauli
Apr-2012	Ultra-thin body and thin-BOX SOI CMOS technology analog ﬁgures of merit	Kilchytska, Valeria I.; Mohd Khairuddin, Md Arshad; Makovejev, Sergej; Olsen, Sarah H.; Andrieu, Francois; Poiroux, Thierry; Faynot, Olivier; Raskin, Jean Pierre; Flandre, Denis; valeriya.kilchytska@uclouvain.be; mohd.khairuddin@unimap.edu.my
Jun-2006	Wafer bumping: A comparative technologies study	Mohd Khairuddin, Md Arshad

Showing results 11 to 17 of 17 < previous