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Browsing by Author Mohd Khairuddin, Md Arshad
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Showing results 2 to 17 of 17
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Issue Date
Title
Author(s)
2006
Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor
Mohd Khairuddin, Md Arshad
;
Uda, Hashim
;
Choo, C.M.
2007
The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition
Mohd Khairuddin, Md Arshad
;
Azman, Jalar
;
Ibrahim, Ahmad
;
Ghazali, Omar
2008
Characterization of intermetallic growth of gold ball bonds on aluminum bond pads
Mohd Khairuddin, Md Arshad
;
Lim, Moy Fung
;
Mohammad Nuzaihan Md. Noor
;
Uda, Hashim
;
mohd.khairuddin@unimap.edu.my
2007
Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
Mohd Khairuddin, Md Arshad
;
Azman, Jalar
;
Ibrahim, Ahmad
2006
The characterization of power supply noise for optical mouse sensor
Mohd Khairuddin, Md Arshad
;
Uda, Hashim
;
Ming, Choo Chew
6-Dec-2005
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
Mohd Khairuddin, Md Arshad
;
Ibrahim, Ahmad
;
Azman, Jalar
;
Uda, Hashim
Sep-2006
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
Mohd Khairuddin, Md Arshad
;
Ibrahim, Ahmad
;
Azman, Jalar
;
Ghazali, Omar
;
Uda, Hashim
2007
FPGA based SPWM Bridge Inverter
Mohd Nazrin, Md Isa
;
Muhammad Imran, Ahmad
;
Sohiful Anuar, Zainol Murad
;
Mohd Khairuddin, Md Arshad
2016
The Impacts of Platinum Diffusion to the Reverse Recovery Lifetime of a High Power Diode Devices
C.M., Cheh
;
Mohd Khairuddin, Md Arshad
;
Ruslinda, Abdul Rahim
;
C., Ibau
;
Voon, Chun Hong
;
Ramzan, Mat Ayub
;
Uda, Hashim
;
mohd.khairuddin@unimap.edu.my
2016
Microwave irradiation assisted synthesis of silicon carbide nanotubes
Tony, V.
;
Voon, C.H.
;
Lee, Chang Chuan, Dr
;
Lim, B.Y.
;
Rahman, W.
;
Uda, Hashim
;
Ruslinda, Abdul Rahim
;
Mohd Khairuddin, Md Arshad
;
Foo, Kai Loong
;
Gopinath, S.C.B. ,
;
Ayoib, A. ,
;
Thivina, V. ,
;
Ba Hashwan, S.S.
14-Mar-2011
Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices
S., Makovejev
;
V., Kilchytska
;
Mohd Khairuddin, Md Arshad
;
D., Flandre
;
F., Andrieu
;
O., Faynot
;
S., Olsen
;
J. P., Raskin
2006
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
Mohd Khairuddin, Md Arshad
;
Ibrahim, Ahmad
;
Azman, Jalar
;
Ghazali, Omar
9-May-2007
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
Mohd Khairuddin, Md Arshad
;
Mohd Nazrin, Md Isa
;
Sohiful Anuar, Zainol Murad
17-Mar-2009
Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad
Mohd Khairuddin, Md Arshad
;
Lim, Moy Fung
;
Uda, Hashim
;
Zaliman, Sauli
Apr-2012
Ultra-thin body and thin-BOX SOI CMOS technology analog figures of merit
Kilchytska, Valeria I.
;
Mohd Khairuddin, Md Arshad
;
Makovejev, Sergej
;
Olsen, Sarah H.
;
Andrieu, Francois
;
Poiroux, Thierry
;
Faynot, Olivier
;
Raskin, Jean Pierre
;
Flandre, Denis
;
valeriya.kilchytska@uclouvain.be
;
mohd.khairuddin@unimap.edu.my
Jun-2006
Wafer bumping: A comparative technologies study
Mohd Khairuddin, Md Arshad