| Issue Date | Title | Author(s) |
| 9-Feb-2017 | Biotechnological processes in microbial Amylase production | Subash C. B., Gopinath; Periasamy, Anbu; Mohd Khairuddin, Md Arshad; Thangavel, Lakshmipriya; Chun, Hong Voon; Uda, Hashim; Suresh V., Chinni; subash@unimap.edu.my |
| 2006 | Characteristics of Serial Peripheral Interfaces (SPI) timing parameters for optical mouse sensor | Mohd Khairuddin, Md Arshad; Uda, Hashim; Choo, C.M. |
| 2007 | The characterization of Al Bond pad surface treatment in Electroless Nickel Immersion Gold (ENIG) deposition | Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad; Ghazali, Omar |
| 2008 | Characterization of intermetallic growth of gold ball bonds on aluminum bond pads | Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Mohammad Nuzaihan Md. Noor; Uda, Hashim; mohd.khairuddin@unimap.edu.my |
| 2007 | Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process | Mohd Khairuddin, Md Arshad; Azman, Jalar; Ibrahim, Ahmad |
| 2006 | The characterization of power supply noise for optical mouse sensor | Mohd Khairuddin, Md Arshad; Uda, Hashim; Ming, Choo Chew |
| 6-Dec-2005 | The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim |
| Sep-2006 | The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim |
| 2007 | FPGA based SPWM Bridge Inverter | Mohd Nazrin, Md Isa; Muhammad Imran, Ahmad; Sohiful Anuar, Zainol Murad; Mohd Khairuddin, Md Arshad |
| 2016 | The Impacts of Platinum Diffusion to the Reverse Recovery Lifetime of a High Power Diode Devices | C.M., Cheh; Mohd Khairuddin, Md Arshad; Ruslinda, Abdul Rahim; C., Ibau; Voon, Chun Hong; Ramzan, Mat Ayub; Uda, Hashim; mohd.khairuddin@unimap.edu.my |
| 2016 | Microwave irradiation assisted synthesis of silicon carbide nanotubes | Tony, V.; Voon, C.H.; Lee, Chang Chuan, Dr; Lim, B.Y.; Rahman, W.; Uda, Hashim; Ruslinda, Abdul Rahim; Mohd Khairuddin, Md Arshad; Foo, Kai Loong; Gopinath, S.C.B. ,; Ayoib, A. ,; Thivina, V. ,; Ba Hashwan, S.S. |
| 14-Mar-2011 | Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices | S., Makovejev; V., Kilchytska; Mohd Khairuddin, Md Arshad; D., Flandre; F., Andrieu; O., Faynot; S., Olsen; J. P., Raskin |
| 2006 | The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition | Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar |
| 9-May-2007 | The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM | Mohd Khairuddin, Md Arshad; Mohd Nazrin, Md Isa; Sohiful Anuar, Zainol Murad |
| 17-Mar-2009 | Thermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond pad | Mohd Khairuddin, Md Arshad; Lim, Moy Fung; Uda, Hashim; Zaliman, Sauli |
| Apr-2012 | Ultra-thin body and thin-BOX SOI CMOS technology analog figures of merit | Kilchytska, Valeria I.; Mohd Khairuddin, Md Arshad; Makovejev, Sergej; Olsen, Sarah H.; Andrieu, Francois; Poiroux, Thierry; Faynot, Olivier; Raskin, Jean Pierre; Flandre, Denis; valeriya.kilchytska@uclouvain.be; mohd.khairuddin@unimap.edu.my |
| Jun-2006 | Wafer bumping: A comparative technologies study | Mohd Khairuddin, Md Arshad |
