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dc.contributor.authorPathak, Jay
dc.contributor.authorDarji, Anand
dc.date.accessioned2019-08-01T08:40:32Z
dc.date.available2019-08-01T08:40:32Z
dc.date.issued2019-07
dc.identifier.citationInternational Journal of Nanoelectronics and Materials, vol.12(3), 2019, pages 319-328en_US
dc.identifier.issn1985-5761 (Printed)
dc.identifier.issn1997-4434 (Online)
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/61121
dc.descriptionLink to publisher's homepage at http://ijneam.unimap.edu.myen_US
dc.description.abstractFinFET technology has emerged to be one of the advanced nanoscale devices for Moore’s Law. The presence of several parasitic components in FinFET has significant effect on the device performance for the channel length of the order 14 nm. The III-V materials are replacing Silicon in FinFET technology to overcome the challenges faced by Silicon. The III-V compound semiconductors material such as Indium Gallium Arsenic (InGaAs), when used as channel material with high-K dielectric oxide materials faces a critical problem of interface traps. In this paper, the significance of interface traps at different energy levels was analysed in 14 nm InGaAs FinFET at high-k/InGaAs channel material. Apart from, the interface traps the gate parasitic capacitance of FinFET with channel material of InGaAs beyond 14 nm gate length was also investigated.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subjectFinFETen_US
dc.subjectInGaAsen_US
dc.subjectInterface traps and parasitic capacitanceen_US
dc.subjectNanoscale devicesen_US
dc.titleImpact of interface traps and parasitic capacitance on gate capacitance of In0.53Ga0.47As-FinFET for sub 14nm technology nodeen_US
dc.typeArticleen_US
dc.contributor.urljaypathak050@gmail.comen_US


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