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dc.contributor.authorZaliman, Sauli, Dr.
dc.contributor.authorVairavan, Rajendaran;
dc.contributor.authorRetnasamy, Vithyacharan
dc.date.accessioned2015-03-04T08:52:01Z
dc.date.available2015-03-04T08:52:01Z
dc.date.issued2014-02
dc.identifier.citationAdvanced Materials Research, vol. 893, 2014, pages 807-810en_US
dc.identifier.issn1662-8985
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/39066
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractHigh power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. In this paper, a simulation study was done to scrutinize the influence of heat slug shape on the heat dissipation of single chip LED package using Ansys version 11. Two types of heat slug shapes, rectangular and cylindrical were used. The analysis was carried out under natural convection condition at ambient temperature of 25°C. Simulated results indicate that rectangular shape heat slug exhibits better heat dissipation.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publications Inc.en_US
dc.subjectAluminum slugen_US
dc.subjectANSYSen_US
dc.subjectHeat slug shapeen_US
dc.subjectHigh power LEDen_US
dc.subjectJunction temperatureen_US
dc.subjectVon mises stressen_US
dc.titleEffects of heat slug shapes on the heat dissipation of high power LEDen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMR.893.807
dc.contributor.urlzaliman@unimap.edu.myen_US


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