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dc.contributor.authorYap, Boon Kar, Dr.
dc.contributor.authorNoor Azrina, Talik
dc.contributor.authorZaliman, Sauli, Dr.
dc.contributor.authorFoong, Chee Seng
dc.contributor.authorTan, Chou Yong, Dr.
dc.contributor.authorRetnasamy, Vithyacharan
dc.date.accessioned2014-04-23T02:51:20Z
dc.date.available2014-04-23T02:51:20Z
dc.date.issued2013
dc.identifier.citationMicroelectronics International, vol. 30(2), 2013, pages 99-103en_US
dc.identifier.issn1356-5362
dc.identifier.urihttp://www.emeraldinsight.com/journals.htm?articleid=17086474
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33932
dc.descriptionLink to publisher's homepage at http://www.emeraldinsight.com/en_US
dc.description.abstractPurpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach - Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings - Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value - The value of the work here is testing of the new environmental friendly water-based MPC cleaning efficiency. The reduction of ionic contamination is thus reported.en_US
dc.language.isoenen_US
dc.publisherEmerald Group Publishing Limiteden_US
dc.subjectContaminationen_US
dc.subjectDecontaminationen_US
dc.subjectFlip chipen_US
dc.subjectFlux cleaningen_US
dc.subjectIonic contaminationsen_US
dc.subjectSolventsen_US
dc.subjectWater-based solventen_US
dc.titleIonic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technologyen_US
dc.typeArticleen_US
dc.contributor.urlkbyap@uniten.edu.myen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlsundres@gmail.comen_US


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