Search
Now showing items 1-10 of 10
Interrogation of surface roughness and bond force effect
(AENSI Publisher All rights reserved, 2013-10)
In the macro world surface roughness is a feature undoubtedly not to be ignored. In the current trend towards the nano-scale feature in the devices related to the semiconductor and other various niche, surface roughness ...
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
(Elsevier Science, 2006)
This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy ...
Surface roughness and wettability correlation on etched platinum using reactive ion ecthing
(Trans Tech Publications, 2014-01)
As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ...
Physical characterization of BST with different (x') ratios
(Trans Tech Publications, 2014)
Nowdays Barium strontium titanate (BST) can be applied into many fields of engineering. Its properties attracted more researchers to research and apply it into many fields of study. In this work, sol-gel method of preparing ...
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
(Trans Tech Publications, 2014)
This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ...
Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
(Trans Tech Publications, 2014)
Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...
Surface roughness analysis on reactive ion etched aluminium deposited wafer
(Trans Tech Publications, 2014)
This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF₄) and Oxygen (O₂) gaseous. A total of ...
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)
This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...
Main effects study on plasma etched aluminium metallization
(Trans Tech Publications, 2014-01)
Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ...
The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM
(American Institute of Physics, 2007-05-09)
This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond ...