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Aluminium surface grain size analysis on RIE treatment
(Trans Tech Publications (TTP), 2013)
Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...
Relationship between controllable process parameters on bump height in ENIG
(Trans Tech Publications, 2013)
This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...
LED heat dissipation study using different Cu slug size
(AENSI Publisher All rights reserved, 2013-10)
High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ...
High power LED heat dissipation analysis via copper diamond slug
(AENSI Publisher All rights reserved, 2013-10)
The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ...
Shear strain analysis in FSS microchannel
(AENSI Publications, 2013-10)
Microfluidics has motivated the development of various fields in biological engineering due to its advantages. The favorable benefits of using microfluidicsare being easy to fabricate, requirement of minimal fluid volumes, ...
Cylindrical shape slug heat conduction numerical analysis using copper material
(AENSI Publications, 2013-10)
High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ...
Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)
The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
Numerical analysis of velocity profile in a FFS microchannel
(AENSI Publisher All rights reserved, 2013-10)
Manipulation of the fluid flow behavior in microfluidic with precision technique is crucial to satisfy the needs of miniaturized systems. Velocity measurement is one of the physical phenomena plays significant role to ...
Heat dissipation analysis under natural convection condition on high power LED
(AENSI Publisher All rights reserved, 2013-10)
As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
(Trans Tech Publications (TTP), 2013)
Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...