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Now showing items 71-80 of 137
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)
The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...
Low loss optimization of strip channel polysilicon waveguide fabrication
(American-Eurasian Network for Scientific Information, 2013)
Research on waveguide structures, its behaviour and material properties are very
extensive for a wide range of applications. Generally, waveguides are used for
optical devices such as biosensors. This paper investigates ...
Design, simulation and characterization of moly permalloy based electromagnetic sensor
(Trans Tech Publications, Switzerland., 2012)
In this paper it is shown the design, simulation and characterization of Moly Permalloy based electromagnetic sensor in MEMS software. The dimension of the device is minimized to the smallest the software can simulate which ...
UTBB SOI MOSFETs analog figures of merit: Effects of ground plane and asymmetric double-gate regime
(Elsevier Ltd., 2013)
In this work we investigate the effect of ground plane (GP) on analog figures of merit (FoM) of ultra-thin body and thin buried oxide (UTBB) SOI MOSFETs. Based on experimental devices, both n- and p-type GP configurations ...
Electrical characterization and equivalent circuit analysis of (Bi1.5Zn0.5)(Nb0.5Ti1.5)O7 Pyrochlore, a relaxor ceramic
(The American Institute of Physics (AIP), 2011)
The ac impedance of (Bi1.5Zn0.5)(Nb0.5Ti1.5)O7, a relaxor ceramic with the pyrochlore structure,
has been measured over the temperature range 10–1073K and analyzed using a combination of
traditional, fixed-frequency ...
Design and analysis of wideband ladder-type film bulk acoustic wave resonator filters in Ku-band
(Hindawi Publishing Corporation, 2013)
This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of -3 dB, out-of-band rejection of -12 dB and 3 dB bandwidth ...
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)
Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...
Shear ram height investigation for gold wire bond shear test
(Trans Tech Publications, 2012-12)
This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...
L-band multi-wavelength Brillouin-Raman fiber laser utilizing the reverse-S-shaped section
(World Scientific Publishing Company., 2014-06)
In this paper, we experimentally demonstrated multi-wavelength Brillouin-Raman fiber laser that operates in the L-band wavelength region. The laser structure utilizes the reverse-S-shaped technique. 35 output Brillouin ...